Ultra-thin flexible copper clad substrate  (FCCL)

Sputtering/plating method

Use the Roll to Roll Sputtering System to prepare a thin copper layer on soft substrates (such as: PET, PI, etc.), and then use the thin copper layer on the plastic substrate to make a thicker copper layer by electroplating to complete the FCCL production. Currently This method is mainly used in products such as LCD driver ICs and COF (Chip on Flex) soft boards with high-density structures.

The Roll to Roll Sputtering System is used to treat the surface of the substrate with plasma technology in a high-vacuum chamber before depositing the thin copper layer, which effectively increases the surface roughness of the soft substrate and improves the adhesion between the thin copper layer and the soft substrate , at the same time with the electroless copper plating process to achieve excellent connection reliability, low surface resistance, high tensile strength and copper crystal continuity.

2L-FCCL Product Features

• This product is the key material of FPC, such as: high-density circuit flexible board (Pitch<30µm), LCD driver IC, COF flexible board, etc.
• Adhesive-free 2L-FCCL was completed using the Roll to Roll Sputtering System combined with the electrochemical deposition process
• It has the advantages of good heat resistance, flexibility, and uniform distribution of surface impedance